Epoxy Resin Adhesive（STYCAST 2850FT BK/CAT 24LV）

Epoxy resin adhesive(STYCAST 2850FT BK/CAT 24LV)

Product Description

Stycast 2850FT is a two-component high thermal conductivity epoxy resin potting compound with low coefficient of thermal expansion, good thermal conductivity (thermal conductivity of 1.3) and excellent electrical insulation properties. 2850FT can be used with a variety of curing agents at different curing temperatures (room temperature to high temperature). Stycast 2850FT can be used with a wide range of curing agents, depending on the curing temperature (room temperature to high temperature). 2850FT is widely used in the potting of sensors, especially thermal sensors.

Characteristics

High thermal conductivity to promote heat dissipation in embedded components

Diversified curing agents for a wide range of applications

Low coefficient of thermal expansion, stress work

Applications

- Stycast 2850FT is primarily used for sealing components that require heat dissipation and resistance to thermal shock.

Instructions for use

In order to ensure the potability and long-term effectiveness of the electrical properties of Stycast 2850FT, the components and substrates must be thoroughly cleaned of dust, water vapor, salt, oil and other contaminants prior to use. This is to avoid electrical failure, poor adhesion or localized corrosion.

Stycast 2850FT is usually subject to some filler settling during transportation and storage, so it is necessary to mix the components in the can well before use.

After the resin and hardener are weighed accurately according to the recommended ratio, put them into a clean container and mix them for 2~3 minutes, prolonging the mixing for 2~3 minutes is more effective. When mixing, be careful to avoid excessive speed, so as not to enter excessive air or cause the mixture to overheat and shorten its working life.

In order to ensure seamless can sealing, must be mixed colloid vacuum degassing, vacuum degassing pressure range of 1-5mmHg. degassing, the mixture in the bubble dramatically increased, the height of the liquid level rises a few times, and finally returned to the original liquid level. After several repetitions, the bubbling stops and the degassing is completed, this process takes about 3-10 minutes. To improve the mixing and degassing effect, the resin can be slightly heated up to 40°C before mixing.

Pour the mixed colloid into the cavity to be encapsulated. Slowly heat the cavity so that the viscosity of the colloid is reduced and the fluidity is increased to allow full intrusion into coil gaps or cavities with complex structures. The mixed colloid in the encapsulation cavity can be re-gassed as required.

Technical Parameters

Epoxy resin properties:

Colloidal properties after mixing:

Curing time:

RECOMMENDATION: Please cure at the recommended temperatures in the table. For best performance, it is recommended that the initial cure be followed by a 2-4 hour cure at the highest temperature desired for use. Alternate temperature curing is also possible.